New 3D Printing Approach Enables More Complex Electrical Routing for 3D Integration of Microelectronic Subsystems

BY Nita Vaidya-Zannino

Demand for higher resolution and high-precision parts is driving the evolution of additive manufacturing. The latest 3D printer design from Boston Micro Fabrication (BMF) uses a new approach called Projection Micro Stereolithography (PµSL), which is capable of printing polymer parts with 2µm resolution — unprecedented metrics in 3D printing. PµSL enables mold-free, ultra-high-resolution, fast prototyping, and end-part capability not possible before.

BMF globally launched their line of commercial micro-precision 3D printers in 2020, and using BMF’s microArch S130 model, HRL Laboratories, LLC, has now demonstrated ceramic interposers with previously impossible slanted and curved vias with diameters of less than 10µm. Vias are small openings in insulating layers that allow conductive connections between semiconductor layers in integrated circuits.

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