Materials
BMF’s open micro 3D printing material system allows you to print with our specially formulated liquid polymers or to print with the material of your choice. Whether you use BMF's materials or choose your own, you have a variety of options available that will allow you to achieve the results you need based on your application.

HTL

HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C.

UTL

UTL offers high toughness and elongation for high flexibility applications.

BIO

BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests.

RG

RG from the Forward AM Ultracur3D® photopolymer resin line is a durable engineering material which can be used to print functional end-use parts. In addition to being biocompatible, it doesn’t uptake any water and is suitable for a wide range of applications such as electrical cases, medical devices, snappers and functional prototyping. Only available on the microArch 200 series.

HT 200

HT 200 is a high temperature material that can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications.

TOUGH

TOUGH is a rigid, robust engineering material with a good combination of strength and elongation. TOUGH can be used to produce end-use parts.

AL Ceramic

AL (Alumina) Ceramic is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance. Only available on the microArch 200 series.

Polymers

71.5
7.8
2397
112.9
2.8
30
169
114.2
45-60°
1.05%
3.45
0.0245
81
85
Yellow trans / black / carbon black*
microArch P130, S130, P140, S140, S230, S240, P150 *Carbon black is only available for use on P140, S140, S240.
Tg 172 °C
14.1
40.8
567
-
-
-
150
<30
45-60°
3.14%
3.17
0.029
69
185
Yellow trans / black
microArch P140, S140, S230, S240
Elongation at Yield: 6.7%
56
6.2
1614
106.6
3.5
15.5
170.3
85.7
50-70°
0.69%
2.75
0.0458
84
300
Yellow trans
microArch P130, S130, P140, S140, S230, S240, P150
Cell culture survival rate in vitro: 75%
60.4
11.7
1765
77.7
2.1
-
157
56.5
45-60°
0.77%
2.94
0.0197
77
1100
Yellow trans
microArch S230, S240
Cell culture survival rate in vitro: 91.7%
87.8
4.6
3074
153.6
3.8
14.5
102
217.8
30-60°
2.70%
2.97
0.0475
78.6
285
Yellow trans
microArch P140, S140, S230, S240, P150
-
82.9
14
2566
122.4
4
18
118
78
30-50°
1.28
2.88
0.033
74.5
180
Yellow trans
P130, S130, P140, S140, S230, S240, P150
-
Criteria HTLUTLBIORGHT 200TOUGH
TENSILE STRENGTH (MPa) 71.5 14.1 56 60.4 87.8 82.9
ELONGATION AT BREAK (%) 7.8 40.8 6.2 11.7 4.6 14
ELASTIC MODULUS (MPa) 2397 567 1614 1765 3074 2566
FLEXURAL STRENGTH (MPa) 112.9 - 106.6 77.7 153.6 122.4
FLEXURAL MODULUS (GPa) 2.8 - 3.5 2.1 3.8 4
IMPACT STRENGTH (J/m) 30 - 15.5 - 14.5 18
CTE (60°C) μm/m/°C 169 150 170.3 157 102 118
HDT @0.45MPa 114.2 <30 85.7 56.5 217.8 78
CONTACT ANGLE 45-60° 45-60° 50-70° 45-60° 30-60° 30-50°
WATER ABSORPTION (24h) 1.05% 3.14% 0.69% 0.77% 2.70% 1.28
DIELECTRIC CONSTANT (10 GHz) 3.45 3.17 2.75 2.94 2.97 2.88
DF 0.0245 0.029 0.0458 0.0197 0.0475 0.033
HARDNESS (SHORE D) 81 69 84 77 78.6 74.5
VISCOSITY (cP) 85 185 300 1100 285 180
COLOR Yellow trans / black / carbon black* Yellow trans / black Yellow trans Yellow trans Yellow trans Yellow trans
COMPATIBLE BMF SYSTEMS microArch P130, S130, P140, S140, S230, S240, P150
*Carbon black is only available for use on P140, S140, S240.
microArch P140, S140, S230, S240 microArch P130, S130, P140, S140, S230, S240, P150 microArch S230, S240 microArch P140, S140, S230, S240, P150 P130, S130, P140, S140, S230, S240, P150
ADDITIONAL Tg 172 °C Elongation at Yield: 6.7% Cell culture survival rate in vitro: 75% Cell culture survival rate in vitro: 91.7% - -

Ceramic

99.8
50
10
3.99
2300
99
400
<0.5
-
-
300
7-8
32
≈1014
microArch S230, S240
Criteria AL
POWDER PURITY (%) 99.8
SLURRY SOLIDS LOADING (vol%) 50
DYNAMIC VISCOSITY [Pa•s] 10
SINTERED CERAMIC THEORETICAL DENSITY (g/cm³) 3.99
COMPRESSIVE STRENGTH (MPa) 2300
RELATIVE DENSITY (%) 99
THREE-POINT BENDING STRENGTH (MPa) 400
SURFACE ROUGHNESS Ra (μm) <0.5
RELATIVE PERMITTIVITY (10 GHz) -
DIELECTRIC LOSS TAN δ (10 GHz) -
YOUNG‘S MODULUS (GPa) 300
COEFFICIENT OF THERMAL EXPANSION 7-8
THERMAL CONDUCTIVITY 32
SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm) ≈1014
COMPATIBLE BMF SYSTEMS microArch S230, S240

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