With collaborations with some of the largest material manufacturers in the world, 20,000 cp printing capability and access to thousands of resins, you have a variety of options available that will allow you to achieve the results you need based on your application.
HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C.
ST1400 offers high toughness and elongation for high flexibility applications.
BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests.
RG from the Forward AM Ultracur3D® photopolymer resin line is a durable engineering material which can be used to print functional end-use parts. In addition to being biocompatible, it doesn’t uptake any water and is suitable for a wide range of applications such as electrical cases, medical devices, snappers and functional prototyping.
HT 200 is a high temperature material that can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications.
TOUGH is a rigid, robust engineering material with a good combination of strength and elongation. TOUGH can be used to produce end-use parts.
AL (Alumina) Ceramic is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance.
BMF MED powered by 3D Systems is a rigid amber material for applications requiring biocompatibility, translucency and/or thermal resistance. It provides parts with crisp details, that can be sterilized and tested at high temperatures, over 100 °C.
LOCTITE 3D 3955
LOCTITE 3D 3955 is a high-performance halogen-free flame retardant UL94-V0 high modulus photopolymer resin. Printable at 60 °C. Available on the microArch S350.
Mechnano’s Formula1µ is a black, rigid, static-dissipative photopolymer resin that was created using the company’s proprietary discrete Carbon Nanotube technology, D’Func, to produce high resolution, Nano-Uniform ESD parts with isotropic properties and no carbon sloughing. Available on the microArch S140, S240 and S350.
Rogers' Radix™ Printable Dielectric Resin
Radix Printable Dielectric ma terials are a ceramic-filled, UV-curable polymer designed for use with photopolymer 3D-printing processes like sterolithography (SLA) and digital light processing (DLP) printing. These materials and printing processes enable the use of high-resolution, scalable 3D-printing for complex RF dielectric components such as gradient index (GRIN) lenses or three-dimensional circuits. Available on the microArch S240 and S350.
|Criteria||HTL||ST1400||BIO||RG||HT 200||TOUGH||BMF MED|
|TENSILE STRENGTH (MPa)||71.5||45||56||60.4||87.8||82.9||57.6|
|ELONGATION AT BREAK (%)||7.8||43||6.2||11.7||4.6||14||13.4|
|ELASTIC MODULUS (MPa)||2397||1900||1614||1765||3074||2566||1706.2|
|FLEXURAL STRENGTH (MPa)||112.9||80||106.6||77.7||153.6||122.4||96.6|
|FLEXURAL MODULUS (GPa)||2.8||1.5||3.5||2.1||3.8||4||2.5|
|IMPACT STRENGTH (J/m)||30||43||15.5||-||14.5||18||19.5|
|CTE (60°C) μm/m/°C||169||111||170.3||157||102||118||165.5|
|WATER ABSORPTION (24h)||1.05%||0.33%||0.69%||0.77%||2.70%||1.28%||0.01%|
|DIELECTRIC CONSTANT (10 GHz)||3.45||3.1||2.75||2.94||2.97||2.88||2.74|
|HARDNESS (SHORE D)||81||78||84||77||78.6||74.5||72|
|COLOR||Yellow trans / black / carbon black*||Yellow trans||Yellow trans||Yellow trans / black / carbon black||Yellow trans||Yellow trans||Yellow trans|
|COMPATIBLE BMF SYSTEMS||microArch S130, S140, S230, S240, S350
*Carbon black is only available for use on S140, S240.
|microArch S140, S240, S350||microArch S130, S140, S230, S240, S350||microArch S230, S240, S350||microArch S140, S230, S240, S350||microArch S130, S140, S230, S240, S350||S230, S240, S350|
|ADDITIONAL||Tg 172 °C||Elongation at Yield: 5.5%||Cell culture survival rate in vitro: 75%||Cell culture survival rate in vitro: 91.7%||-||-||Cell culture survival rate in vitro: 95.6%|
|SLURRY||SOLIDS LOADING (vol%)||51.4|
|DYNAMIC VISCOSITY [Pa•s]||8400|
|SINTERED CERAMIC||THEORETICAL DENSITY (g/cm³)||3.99|
|COMPRESSIVE STRENGTH (MPa)||2300|
|RELATIVE DENSITY (%)||99.5|
|THREE-POINT BENDING STRENGTH (MPa)||500|
|SURFACE ROUGHNESS Ra (μm)||-|
|RELATIVE PERMITTIVITY (10 GHz)||-|
|DIELECTRIC LOSS TAN δ (10 GHz)||-|
|YOUNG‘S MODULUS (GPa)||300|
|COEFFICIENT OF THERMAL EXPANSION||7-8|
|SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm)||1014|
|COMPATIBLE BMF SYSTEMS||microArch S230, S240|