Materials
BMF’s open micro 3D printing material system allows you to print with our specially formulated liquid polymers or to print with the material of your choice. Whether you use BMF's materials or choose your own, you have a variety of options available that will allow you to achieve the results you need based on your application.

GR

GR offers the best stiffness, with good impact strength and heat resistance.

HEK

HEK is a rigid, tough material with a good combination of strength and elongation.

HTL

HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 140°C.

UTL

UTL offers high toughness and elongation for high flexibility applications.

BIO

BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests.

RG

RG from the Forward AM Ultracur3D® photopolymer resin line is a durable engineering material which can be used to print functional end-use parts. In addition to being biocompatible, it doesn’t uptake any water and is suitable for a wide range of applications such as electrical cases, medical devices, snappers and functional prototyping. Only available on the microArch 200 series.

HT 200

HT 200 is a high temperature material that can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications.

AL Ceramic

AL (Alumina) Ceramic is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance. Only available on the microArch 200 series.

MT Ceramic

The combination of high dielectric constant and low dielectric loss make MT (Magnesium Titanate) Ceramic suitable for millimeter wave applications such as antennas, wave guides, and other electronic components. Only available on the microArch 200 series.

Polymers

54.4
8.8
1442
66.6
1.8
47.5
51
75
45-60°
12.41%
-
-
80
25
Yellow trans / black
-
57
3
3029
112.9
2.8
30
47.5
114.2
45-60°
1.05%
3.45
0.0245
81
85
Yellow trans / black / carbon black
Tg 172 °C
48.5
7.1
1169
50.6
1.7
-
109
51.5
45-60°
2.28%
3.3
0.0225
78
450-500
Yellow trans / black
-
9.4
51.5
49
-
-
-
150
-
45-60°
3.14%
3.17
-
69
185
Yellow trans / black
Elongation at Yield: 6.7%
55.1
8.4
947
102
2.3
-
60
109.1
45-60°
0.56%
2.99
0.0311
80
20
Yellow trans
Cell culture survival rate in vitro: 75%
60
23
1143
77.7
2.1
-
130
56.5
45-60°
0.77%
2.94
0.020
77
1090
Yellow trans / black
Cell culture survival rate in vitro: 91.7%
51
4.9
1040
153.6
3.8
109.78
97
217.8
30-60°
0.008
-
-
78.6
285
Yellow trans / black
-
CriteriaGRHTLHEKUTLBIORGHT 200
TENSILE STRENGTH (MPa)54.45748.59.455.16051
ELONGATION AT BREAK (%)8.837.151.58.4234.9
ELASTIC MODULUS (MPa)1442302911694994711431040
FLEXURAL STRENGTH (MPa)66.6112.950.6 -10277.7153.6
FLEXURAL MODULUS (GPa)1.82.81.7-2.32.13.8
IMPACT STRENGTH (J/m)47.530----109.78
CTE (60°C) μm/m/°C5147.51091506013097
HDT @0.45MPa75114.251.5 -109.156.5217.8
CONTACT ANGLE45-60°45-60°45-60°45-60°45-60°45-60°30-60°
WATER ABSORPTION (24h)12.41%1.05%2.28%3.14%0.56%0.77%0.008
DIELECTIC CONSTANT (10 GHz)-3.453.33.172.992.94-
DF-0.02450.0225-0.03110.020-
HARDNESS (SHORE D)8081 7869807778.6
VISCOSITY (cP)2585450-500185201090285
COLORYellow trans / blackYellow trans / black / carbon blackYellow trans / blackYellow trans / blackYellow transYellow trans / blackYellow trans / black
ADDITIONAL-Tg 172 °C-Elongation at Yield: 6.7%Cell culture survival rate in vitro: 75%Cell culture survival rate in vitro: 91.7%-

Ceramics

99.8
50
10
3.99
2300
99
400
<0.5
-
-
300
7-8
32
≈1014
99.5
49.4
6
3.69
-
98.5
125
<0.2
19.89
2.368*10-4
-
9-10
32
-
CriteriaALMT
POWDERPURITY (%)99.899.5
SLURRYSOLIDS LOADING (vol%)5049.4
DYNAMIC VISCOSITY [Pa•s]106
SINTERED CERAMICTHEORETICAL DENSITY (g/cm³)3.993.69
COMPRESSIVE STRENGTH (MPa)2300-
RELATIVE DENSITY (%)9998.5
THREE-POINT BENDING STRENGTH (MPa)400125
SURFACE ROUGHNESS Ra (μm)<0.5<0.2
RELATIVE PERMITTIVITY (10 GHz)-19.89
DIELECTRIC LOSS TAN δ (10 GHz)-2.368*10-4
YOUNG‘S MODULUS (GPa)300-
COEFFICIENT OF THERMAL EXPANSION7-89-10
THERMAL CONDUCTIVITY3232
SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm)≈1014-

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