Electronics are becoming smaller, more tightly packaged, and subjected to more demanding conditions. Miniaturization, the growing number and density of electronic components, and faster data speeds that produce more heat are just some of the challenges that today’s electronic designers face. During the design process, engineers want prototypes that are as close as possible to production-quality, which is where electronic component 3D printing comes in.
3D printing electronic components eliminates the tooling used in micro injection molding and can reduce time-to-market across multiple design iterations and test cycles. BMF’s Projection Micro Stereolithography (PµSL) technology can 3D print electronic components with ultra-high resolution, accuracy and precision.
Below is a compilation of 3D printed electronic components fabricated on BMF’s microArch printers:
Electronic Connectors
Electronic connector bases are an integral part to modern electronics. Here are the specs for this connector:
- Printer Model – microArch S140
- Dimensions – 22mm x 4mm x 6mm
- Resolution – 10 mm
- Tolerance – ±0.025mm
- Features – minimum hole diameter of 0.1mm, minimum wall thickness of 0.1mm for a large area
3D printing electronic components allows parts to be customized. Here are the specs for another version of an electronic connector:
- Printer Model – microArch S140
- Dimensions – 41mm x 7.7mm x 4.65mm
- Resolution – 10 µm
- Tolerance – ±0.025mm
- Features – lead time of less than one day, integrated forming of complex parts
Here are the specs for a third electronic connector:
- Printer Model – microArch P140
- Dimensions – 7.1mm x 17.8mm x 3.7mm
- Resolution – 10 µm
- Tolerance – ±0.025mm
A Chip Array Socket
Chip array sockets are often used in computers to provide mechanical and electrical connections between a microprocessor and a circuit board. Here are the specs for this chip array socket:
- Printer Model – microArch S140
- Dimensions – 32 mm x 28 mm x 4 mm
- Resolution – 10 µm
- Tolerance – ±0.025mm
- Features – mirror finish, sharpest edges, heat resistant, 1500 micro holes
A Land Grid Array
Like chip array sockets, land grid arrays are used in electronics to provide mechanical and electrical connections. As electronics shrink, the design for land grid arrays also have to get smaller. 3D printing provides an easy and economical method for producing these electronic components.
Here are the specs for this land grid array:
- Printer Model – microArch S140
- Dimensions – 75mm x 30mm x 1.5mm
- Resolution – 10 µm
- Tolerance – ±0.025mm
- Features – 2500 trapezoidal hole arrays, a protrusion structure in each hole
