Materials
BMF’s open micro 3D printing material system allows you to print with our specially formulated liquid polymers or to print with the material of your choice.

With collaborations with some of the largest material manufacturers in the world, 20,000 cp printing capability and access to thousands of resins, you have a variety of options available that will allow you to achieve the results you need based on your application.

BMF Materials

Materials that are formulated and manufactured by BMF specifically for use on the microArch platform of 3D printers.

HTL

HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C.

ST1400

ST1400 offers high toughness and elongation for high flexibility applications.

BIO

BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests.

RG

RG from the Forward AM Ultracur3D® photopolymer resin line is a durable engineering material which can be used to print functional end-use parts. In addition to being biocompatible, it doesn’t uptake any water and is suitable for a wide range of applications such as electrical cases, medical devices, snappers and functional prototyping.

HT 200

HT 200 is a high temperature material that can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications.

TOUGH

TOUGH is a rigid, robust engineering material with a good combination of strength and elongation. TOUGH can be used to produce end-use parts.

AL Ceramic

AL (Alumina) Ceramic is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance.

BMF MED

BMF MED powered by 3D Systems is a rigid amber material for applications requiring biocompatibility, translucency and/or thermal resistance. It provides parts with crisp details, that can be sterilized and tested at high temperatures, over 100 °C.

Third-Party Materials

Materials that have been tested and verified by BMF’s team of material scientists and are compatible with the microArch platform of 3D printers.

LOCTITE 3D 3955

LOCTITE 3D 3955 is a high-performance halogen-free flame retardant UL94-V0 high modulus photopolymer resin. Printable at 60 °C. Available on the microArch S350.

Formula1µ

Mechnano’s Formula1µ is a black, rigid, static-dissipative photopolymer resin that was created using the company’s proprietary discrete Carbon Nanotube technology, D’Func, to produce high resolution, Nano-Uniform ESD parts with isotropic properties and no carbon sloughing. Available on the microArch S140, S240 and S350.

Rogers' Radix™ Printable Dielectric Resin

Radix Printable Dielectric ma terials are a ceramic-filled, UV-curable polymer designed for use with photopolymer 3D-printing processes like sterolithography (SLA) and digital light processing (DLP) printing. These materials and printing processes enable the use of high-resolution, scalable 3D-printing for complex RF dielectric components such as gradient index (GRIN) lenses or three-dimensional circuits. Available on the microArch S240 and S350.

Polymers

71.5
7.8
2397
112.9
2.8
30
169
114.2
45-60°
1.05%
3.45
0.0245
81
85
Yellow translucent / black / carbon black*
microArch S130, S140, S230, S240, S350 *Carbon black is only available for use on S140, S240, S350.
Tg 172 °C
45
43
1900
80
1.5
43
111
57
30-60°
0.33%
3.1
0.058
78
280
Yellow translucent
microArch S140, S240, S350
Elongation at Yield: 5.5%
56
6.2
1614
106.6
3.5
15.5
170.3
85.7
50-70°
0.69%
2.75
0.0458
84
300
Yellow translucent
microArch S130, S140, S230, S240, S350
Cell culture survival rate in vitro: 75%
60.4
11.7
1765
77.7
2.1
-
157
56.5
45-60°
0.77%
2.94
0.0197
77
1100
Yellow translucent / black / carbon black*
microArch S230, S240, S350 *Carbon black is only available for use on S240, S350.
Cell culture survival rate in vitro: 91.7%
87.8
4.6
3074
153.6
3.8
14.5
102
217.8
30-60°
2.70%
2.97
0.0475
78.6
285
Yellow translucent / black
microArch S130, S140, S230, S240, S350
-
82.9
14
2566
122.4
4
18
118
78
30-50°
1.28%
2.88
0.033
74.5
180
Yellow translucent / carbon black*
microArch S130, S140, S230, S240, S350 *Carbon black is only available for use on S140, S240, S350.
-
57.6
13.4
1706.2
96.6
2.5
19.5
165.5
82.3
45-60°
0.01%
2.74
0.0516
72
1100
Yellow translucent
S230, S240, S350
Cell culture survival rate in vitro: 95.6%
Criteria HTLST1400BIORGHT200TOUGHBMF MED
TENSILE STRENGTH (MPa) 71.5 45 56 60.4 87.8 82.9 57.6
ELONGATION AT BREAK (%) 7.8 43 6.2 11.7 4.6 14 13.4
ELASTIC MODULUS (MPa) 2397 1900 1614 1765 3074 2566 1706.2
FLEXURAL STRENGTH (MPa) 112.9 80 106.6 77.7 153.6 122.4 96.6
FLEXURAL MODULUS (GPa) 2.8 1.5 3.5 2.1 3.8 4 2.5
IMPACT STRENGTH (J/m) 30 43 15.5 - 14.5 18 19.5
CTE (60°C) μm/m/°C 169 111 170.3 157 102 118 165.5
HDT @0.45MPa 114.2 57 85.7 56.5 217.8 78 82.3
CONTACT ANGLE 45-60° 30-60° 50-70° 45-60° 30-60° 30-50° 45-60°
WATER ABSORPTION (24h) 1.05% 0.33% 0.69% 0.77% 2.70% 1.28% 0.01%
DIELECTRIC CONSTANT (10 GHz) 3.45 3.1 2.75 2.94 2.97 2.88 2.74
DF 0.0245 0.058 0.0458 0.0197 0.0475 0.033 0.0516
HARDNESS (SHORE D) 81 78 84 77 78.6 74.5 72
VISCOSITY (cP) 85 280 300 1100 285 180 1100
COLOR Yellow translucent / black / carbon black* Yellow translucent Yellow translucent Yellow translucent / black / carbon black* Yellow translucent / black Yellow translucent / carbon black* Yellow translucent
COMPATIBLE BMF SYSTEMS microArch S130, S140, S230, S240, S350
*Carbon black is only available for use on S140, S240, S350.
microArch S140, S240, S350 microArch S130, S140, S230, S240, S350 microArch S230, S240, S350
*Carbon black is only available for use on S240, S350.
microArch S130, S140, S230, S240, S350 microArch S130, S140, S230, S240, S350
*Carbon black is only available for use on S140, S240, S350.
S230, S240, S350
ADDITIONAL Tg 172 °C Elongation at Yield: 5.5% Cell culture survival rate in vitro: 75% Cell culture survival rate in vitro: 91.7% - - Cell culture survival rate in vitro: 95.6%

Ceramic

99.99
51.4
8400
3.99
2300
99.5
500
-
-
-
300
7-8
32
10^14
microArch S230 (with T40 vat and platform), S240 (with T200 vat and platform)
Criteria AL
POWDER PURITY (%) 99.99
SLURRY SOLIDS LOADING (vol%) 51.4
DYNAMIC VISCOSITY [Pa•s] 8400
SINTERED CERAMIC THEORETICAL DENSITY (g/cm³) 3.99
COMPRESSIVE STRENGTH (MPa) 2300
RELATIVE DENSITY (%) 99.5
THREE-POINT BENDING STRENGTH (MPa) 500
SURFACE ROUGHNESS Ra (μm) -
RELATIVE PERMITTIVITY (10 GHz) -
DIELECTRIC LOSS TAN δ (10 GHz) -
YOUNG‘S MODULUS (GPa) 300
COEFFICIENT OF THERMAL EXPANSION 7-8
THERMAL CONDUCTIVITY 32
SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm) 10^14
COMPATIBLE BMF SYSTEMS microArch S230 (with T40 vat and platform), S240 (with T200 vat and platform)

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