In a recent study led by Oraib Al-Ketan at New York University Abu Dhabi, Boston Micro Fabrication’s microArch S240 system played a key role in developing 3D micro-architected heat sinks to tackle modern thermal management challenges. By using AM-assisted casting and the precise 10µm XY resolution of the S240, the team created advanced heat sink designs that achieved up to 13% temperature reduction under forced convection. This method merges the design flexibility of additive manufacturing with casting’s scalability, offering effective cooling solutions for compact electronic devices.