In “Micro Machines,” the October 2026 cover story, BMF Senior Applications Engineer Jake Collins talks with editor Louise Davis about what electronics engineers can design when they’re no longer limited by planar PCBs, molds and machining. The four-page feature covers 3D-routed interconnects, fiber arrays for data centers, RF and mmWave antennas, and smaller wearables, plus a case study on Horizon Microtechnologies’ single-part corrugated horn antenna.