CMM •
July 3, 2025
Advancing Interposer Design for Next-Generation Microelectronics
As electronic systems become smaller, faster, and more functionally integrated, the packaging technologies that connect them must evolve. Traditional approaches like printed circuit boards, LTCC, and lithography-based fabrication often fall short when it comes to routing complex electrical pathways—especially in compact 3D architectures or between non-planar components.