With collaborations with some of the largest material manufacturers in the world, 20,000 cp printing capability and access to thousands of resins, you have a variety of options available that will allow you to achieve the results you need based on your application.
BMF Materials
HTL
HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C.
ST1400
ST1400 offers high toughness and elongation for high flexibility applications.
BIO
BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests.
RG
RG from the Forward AM Ultracur3D® photopolymer resin line is a durable engineering material which can be used to print functional end-use parts. In addition to being biocompatible, it doesn’t uptake any water and is suitable for a wide range of applications such as electrical cases, medical devices, snappers and functional prototyping.
HT 200
HT 200 is a high temperature material that can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications.
TOUGH
TOUGH is a rigid, robust engineering material with a good combination of strength and elongation. TOUGH can be used to produce end-use parts.
AL Ceramic
AL (Alumina) Ceramic is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance.
HTF
HTF is a heat resistant and tough resin with a high HDT, tensile strength, and biocompatibility.
BMF MED
BMF MED powered by 3D Systems is a rigid amber material for applications requiring biocompatibility, translucency and/or thermal resistance. It provides parts with crisp details, that can be sterilized and tested at high temperatures, over 100 °C.
SR
SR is a soluble resin that can be used as a sacrificial material to print single-use molds to manufacture parts in other materials. SR dissolves in a 5:95 solution of sodium hydroxide to distilled water.
Third-Party Materials
LOCTITE 3D 3955
LOCTITE 3D 3955 is a high-performance halogen-free flame retardant UL94-V0 high modulus photopolymer resin. Printable at 60 °C. Available on the microArch S350.
Formula1µ
Mechnano’s Formula1µ is a black, rigid, static-dissipative photopolymer resin that was created using the company’s proprietary discrete Carbon Nanotube technology, D’Func, to produce high resolution, Nano-Uniform ESD parts with isotropic properties and no carbon sloughing. Available on the microArch S140, S240 and S350.
Ultracur3D® RG 3280
Ceramic-filled resin with exceptionally high stiffness and temperature resistance. Due to the high loading of ceramic particles, this material has an extremely high stiffness around 10 GPa and an HDT B above 280°C.
Figure 4 HI TEMP 300-AMB
Industry-leading, ultra-high temperature resistant rigid plastic suitable for the harshest thermal environments.
Rogers' Radix™ Printable Dielectric Resin
Radix Printable Dielectric materials are a ceramic-filled, UV-curable polymer designed for use with photopolymer 3D-printing processes like sterolithography (SLA) and digital light processing (DLP) printing. These materials and printing processes enable the use of high-resolution, scalable 3D-printing for complex RF dielectric components such as gradient index (GRIN) lenses or three-dimensional circuits. Available on the microArch S240 and S350.
Polymers
| Criteria | HTL | ST1400 | BIO | RG | HT 200 | TOUGH | BMF MED | SR | HTF |
|---|---|---|---|---|---|---|---|---|---|
| TENSILE STRENGTH (MPa) | 71.5 | 45 | 56 | 60.4 | 87.8 | 82.9 | 57.6 | 38 | 96.32 |
| ELONGATION AT BREAK (%) | 7.8 | 43 | 6.2 | 11.7 | 4.6 | 14 | 13.4 | 26 | 7.04 |
| ELASTIC MODULUS (MPa) | 2397 | 1900 | 1614 | 1765 | 3074 | 2566 | 1706.2 | - | 2617.74 |
| FLEXURAL STRENGTH (MPa) | 112.9 | 80 | 106.6 | 77.7 | 153.6 | 122.4 | 96.6 | - | 136.94 |
| FLEXURAL MODULUS (GPa) | 2.8 | 1.5 | 3.5 | 2.1 | 3.8 | 4 | 2.5 | - | 3.5 |
| IMPACT STRENGTH (J/m) | 30 | 43 | 15.5 | - | 14.5 | 18 | 19.5 | 114 | 30.3 |
| CTE (60°C) μm/m/°C | 169 | 111 | 170.3 | 157 | 102 | 118 | 165.5 | - | 102 |
| HDT @0.45MPa | 114.2 | 57 | 85.7 | 56.5 | 217.8 | 78 | 82.3 | - | 152.45 |
| CONTACT ANGLE | 45-60° | 30-60° | 50-70° | 45-60° | 30-60° | 30-50° | 45-60° | - | - |
| WATER ABSORPTION (24h) | 1.05% | 0.33% | 0.69% | 0.77% | 2.70% | 1.28% | 0.01% | - | 0.50 |
| DIELECTRIC CONSTANT (10 GHz) | 3.45 | 3.1 | 2.75 | 2.94 | 2.97 | 2.88 | 2.74 | - | 3.0183 |
| DF | 0.0245 | 0.058 | 0.0458 | 0.0197 | 0.0475 | 0.033 | 0.0516 | - | 0.0705 |
| HARDNESS (SHORE D) | 81 | 78 | 84 | 77 | 78.6 | 74.5 | 72 | 60 | 91 |
| VISCOSITY (cP) | 85 | 280 | 300 | 1100 | 285 | 180 | 1100 | 25 | 381 |
| COLOR | Yellow translucent / black / carbon black* | Yellow translucent | Yellow translucent | Yellow translucent / black / carbon black* | Yellow translucent | Yellow translucent / carbon black* | Yellow translucent | Yellow translucent | Yellow translucent |
| COMPATIBLE BMF SYSTEMS | microArch S130, S140, S230, S240, S350 *Carbon black is only available for use on S140, S240, S350. |
microArch S140, S240, S350 | microArch S130, S140, S230, S240, S350 | microArch S230, S240, S350 *Carbon black is only available for use on S240, S350. |
microArch S130, S140, S230, S240, S350 | microArch S130, S140, S230, S240, S350 *Carbon black is only available for use on S140, S240, S350. |
microArch S230, S240, S350 | microArch S140, S240, S350, D1025 | microArch S140, S240, S350, D1025 |
| ADDITIONAL | Tg 172 °C | Elongation at Yield: 5.5% | Cell culture survival rate in vitro: 75% | Cell culture survival rate in vitro: 91.7% | - | - | Cell culture survival rate in vitro: 95.6% | - | - |
Ceramic
| Criteria | AL | |
|---|---|---|
| POWDER | PURITY (%) | 99.99 |
| SLURRY | SOLIDS LOADING (vol%) | 51.4 |
| DYNAMIC VISCOSITY [Pa•s] | 8400 | |
| SINTERED CERAMIC | THEORETICAL DENSITY (g/cm³) | 3.99 |
| COMPRESSIVE STRENGTH (MPa) | 2300 | |
| RELATIVE DENSITY (%) | 99.5 | |
| THREE-POINT BENDING STRENGTH (MPa) | 500 | |
| SURFACE ROUGHNESS Ra (μm) | - | |
| RELATIVE PERMITTIVITY (10 GHz) | - | |
| DIELECTRIC LOSS TAN δ (10 GHz) | - | |
| YOUNG‘S MODULUS (GPa) | 300 | |
| COEFFICIENT OF THERMAL EXPANSION | 7-8 | |
| THERMAL CONDUCTIVITY | 32 | |
| SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm) | 10^14 | |
| COMPATIBLE BMF SYSTEMS | microArch S230 (with T40 vat and platform), S240 (with T200 vat and platform) | |