We are excited to announce the launch of two new ceramic 3D Printing materials available for use on our microArch S200 series – AL Alumina Ceramic and MT Magnesium Titanate Ceramic. Ceramics are great for applications that require hardness and high heat resistance.
In addition, we’ve launched a new high temp material, HT 200 that can can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications.
Alumina AL Ceramic
Our new Alumina Ceramic material is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance.
Key benefits:
Target applications/industries: Tooling (injection molding), Casings and housings, Medical devices
| PURITY (%) | SOLIDS LOADING (vol%) | DYNAMIC VISCOSITY [Pa•s] | THEORETICAL DENSITY (g/cm ) | COMPRESSIVE STRENGTH (MPa) | RELATIVE DENSITY (%) | THREE-POINT BENDING STRENGTH (MPa) | SURFACE ROUGHNESS Ra (μm) | YOUNG‘S MODULUS (GPa) | COEFFICIENT OF THERMAL EXPANSION (ppm/K) | THERMAL CONDUCTIVITY (W/(m•K)) | SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
PURITY (%)
99.8 |
SOLIDS LOADING (vol%)
50 |
DYNAMIC VISCOSITY [Pa•s]
10 |
THEORETICAL DENSITY (g/cm )
3.99 |
COMPRESSIVE STRENGTH (MPa)
2300 |
RELATIVE DENSITY (%)
99 |
THREE-POINT BENDING STRENGTH (MPa)
400 |
SURFACE ROUGHNESS Ra (μm)
<0.5 |
YOUNG‘S MODULUS (GPa)
300 |
COEFFICIENT OF THERMAL EXPANSION (ppm/K)
7-8 |
THERMAL CONDUCTIVITY (W/(m•K))
32 |
SPECIFIC ELECTRICAL RESISTIVITY (Ω•cm)
≈1014 |
MT Magnesium Titanate Ceramic
The combination of high dielectric constant and low dielectric loss make MT Ceramic suitable for millimeter wave applications such as antennas, wave guides, and other electronic components.
Key benefits:
Target applications/industries: Communications and aerospace, waveguides,
mm wave electronic components (sensors, radar cover, antenna, wave tuning components)
| PURITY (%) | SOLIDS LOADING (vol%) | DYNAMIC VISCOSITY [Pa•s] | THEORETICAL DENSITY (g/cm ) | RELATIVE DENSITY (%) | THREE-POINT BENDING STRENGTH (MPa) | SURFACE ROUGHNESS Ra (μm) | RELATIVE PERMITTIVITY (10 GHz) | DIELECTRIC LOSS TANδ (10 GHz) | COEFFICIENT OF THERMAL EXPANSION (ppm/K) | THERMAL CONDUCTIVITY (W/(m•K)) |
|---|---|---|---|---|---|---|---|---|---|---|
|
PURITY (%)
99.5 |
SOLIDS LOADING (vol%)
49.4 |
DYNAMIC VISCOSITY [Pa•s]
6 |
THEORETICAL DENSITY (g/cm )
3.69 |
RELATIVE DENSITY (%)
98.5 |
THREE-POINT BENDING STRENGTH (MPa)
125 |
SURFACE ROUGHNESS Ra (μm)
<0.2 |
RELATIVE PERMITTIVITY (10 GHz)
19.89 |
DIELECTRIC LOSS TANδ (10 GHz)
2.368*10-4 |
COEFFICIENT OF THERMAL EXPANSION (ppm/K)
9-10 |
THERMAL CONDUCTIVITY (W/(m•K))
32 |
As a current BMF customer, we’ve been thrilled with the performance of our microArch S130 to support our work in micro-printing ceramics - providing the resolution, accuracy and precision necessary for our parts. As the first customer of the new microArch S230, the next generation 2µm system, we are excited to utilize the enhancements of the platform to increase our part capacity with the larger build volume and speed up our printing times. We are looking forward to continuing to work with the BMF team and their line of micro-precision 3D printers to support our micro part needs.
– Toby Schaedler, Manager, Architected Materials and Structures Department at HRL Laboratories, LLC